MPF films for wafer bumping, are excellent in both photo stencil and electroplating processes. These wafer bumping films are available in a range of 50-120 microns thicknesses.
Advanced Packaging Product Benefits:
- Higher yield and quality through uniform resist thickness across the entire wafer.
- Higher productivity without need for drying or double coating; no edge bead removal.
- Low waste generation with up to 73% yield polymer use.
- Environmental benefits from reduced material wastage and a solvent free process.
A high resolution, multi-purpose polymer film, compatible with lead free electroplating and stencil printing applications. These films are available in 50, 75, 100 and 120 micron thicknesses.
Product Features:
- Negative working, aqueous, processable polymer film.
- High aspect ratio resolution
- Suitable for In-via and mushroom electroplating bumping applications.
- Suitable for copper pillar and other lead free applications
- High heat resistance for stencil printing bumping applications
A high resolution, multi-purpose polymer film compatible with most gold plating applications. These films are available in a 50 micron thickness.
Product Features:
- Negative working, aqueous, processable polymer film.
- Suitable for In-via and mushroom electroplating bumping applications.
- Compatible with silicon, silicon nitride, sputtered copper and sputtered gold surfaces.
- Exhibits good adhesion to glass, polymers and other metals and oxides.
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WBR2000 Series