Particlear™ is a new technology to bring an environmentally friendly silica-based flocculant to the water and wastewater treatment industry. Learn more about applications in poultry processing, beef processing, and municipal water.

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DuPont PerMx Series is a new version of permanent microlithographic polymer films. PerMx is designed for a variety of applications, including redistribution, bonding and structuring. These films are available in a range of 15-20 micron thicknesses.

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DuPont Soy Polymers offers a line of functional soy-based additives that can be formulated as the sole adhesive component or in combination with other materials/binders in water-based adhesive applications.

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Hard-sided container for the transport and storage of seed products in bulk.

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A unique breathable composite for critical environments that provides excellent liquid and particle barrier.

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A three-layer spunbonded-meltblown-spunbonded polypropylene fabric that is useful for protection against non-hazardous materials and when repellency from non-hazardous light liquid splash is needed.

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A unique composite of breathable film and nonwoven fabric that provides an excellent protective barrier against particles and many toxic liquids.

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A proprietary composite of breathable film and nonwoven fabric that is lightweight and soft, yet strong, whether wet or dry.

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Two component etch and scratch resistant baking clear used over waterborne basecoats.

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When your work involves the risk of electric arc hazards, protection and safety come first. DuPont™ Protera™ fabric meets NFPA 70E Category 2 requirements and the protection won’t wash or wear away.

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DuPont™ Punch™ soybean fungicide is available for use on soybeans for the control of Asian soybean rust through Section 18 quarantine exemptions.

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Pyralux® bonding films include Coverlays which consist of DuPont™ Kapton® polyimide film coated on one side with adhesive, and Bondplys which are coated on both sides. Our Pyralux® Adhesive films are coated onto release paper used primarily to bond flexible inner layers or rigid cap layers in multilayer circuits.

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The Pyralux® family of products include flexible, solderable, metal clad laminates, coverlays, and bonding adhesives for the fabrication of thin, solderable, high density electrical interconnects. These are used to make circuitry for single and double-sided, multilayer flex and rigid-flex applications.

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Pyralux® laminates come in a broad range of copper, dielectric and adhesive thicknesses and are available as adhesive based or adhesiveless constructions.

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