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Via Fill Paste & Shielding Materials

DuPont Electronics offers a wide array of new copper-based products and a new carbon product for rigid circuit boards and flexible circuits. This new technology from DuPont provides low-cost alternatives for shielding against electro-magnetic interference (EMI) and up to 30 percent cost savings compared with traditional EMI shielding options. Circuit designers can reduce layer count, by eliminating one or more copper foil/laminate layers, thus creating thinner circuits which saves materials and processing costs.