Color proofing media specifically designed for the Epson Stylus Pro 5000. Provides more control of color earlier in the print production process.

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PPD is a low toxicity diamine used as a component of engineering polymers and composites, aramid fibers, hair dyes, rubber chemicals, textile dyes and pigments.

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Particlear™ is a new technology to bring an environmentally friendly silica-based flocculant to the water and wastewater treatment industry. Learn more about applications in poultry processing, beef processing, and municipal water.

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DuPont is committed to protecting people. From first responders to industrial workers, DuPont provides protective apparel solutions to meet your safety needs.

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Semiconductor wafers are produced by stacking alternating conductive and dielectric layers on the silicon wafer.

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Surface prep, cleaners and sealers used to create adhesion and flexibility on plastic substrates in the automotive industry.

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Washout solutions.

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Polyimide films are frequently used as a "stress buffer" or protective overcoat for semiconductors. Polyimide stress buffers are typically 4-6 microns in thickness, and protect the delicate thin films of metal and oxides on the chip surface from damage during handling and from induced stress after encapsulation in plastic molding compound.

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Used on high density printed wiring boards to enhance both thermal and electrical conductivity for various applications including buried vias or printed wiring boards with microvia layers. Combining these properties with copper and carbon products for flexible and rigid circuit applications the CB Series offers shielding against electro-magnetic interference (EMI) providing up to 30 percent cost savings compared with traditional EMI shielding options.

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From a captive raw material base, we began producing poly(hydroxystyrene) based polymers in the early 1980’s. Since this time, we have developed a deep understanding of polymer assembly and architecture.

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PVF products offer a unique balance of aesthetics while offering the durability of a fluoropolymer.

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Everything you need to know for easy and effective pool care. This easy to use system shows you, week by week, month by month, exactly what you need to do to keep your pool sparkling clear and ready to use.

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Aqueous & Semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes used in the microelectronics industry.

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Baking clearcoat in powder form.

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Baking primer in powder form.

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The primer layer is the coating layer that joins a corrosion-protected substrate to the topcoat. It functions to smooth out surface irregularities, improve stone-chip performance, and helps to protect the substrate from visible and UV light.

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Protective layer between the electrodeposition coating and topcoat.

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DuPont Soy Polymers offers a line of functional soy-based additives that can be formulated as the sole adhesive component or in combination with other materials/binders in water-based adhesive applications.

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Hard-sided container for the transport and storage of seed products in bulk.

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A unique breathable composite for critical environments that provides excellent liquid and particle barrier.

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DuPont Professional Products brings the company’s 200-year tradition of science and innovation to the global pest management, green and golf industries.

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A three-layer spunbonded-meltblown-spunbonded polypropylene fabric that is useful for protection against non-hazardous materials and when repellency from non-hazardous light liquid splash is needed.

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A unique composite of breathable film and nonwoven fabric that provides an excellent protective barrier against particles and many toxic liquids.

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A proprietary composite of breathable film and nonwoven fabric that is lightweight and soft, yet strong, whether wet or dry.

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Two component etch and scratch resistant baking clear used over waterborne basecoats.

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Two component etch and scratch resistant baking clear used over waterborne basecoats.

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When your work involves the risk of electric arc hazards, protection and safety come first. DuPont™ Protera™ fabric meets NFPA 70E Category 2 requirements and the protection won’t wash or wear away.

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DuPont™ Punch™ soybean fungicide is available for use on soybeans for the control of Asian soybean rust through Section 18 quarantine exemptions.

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Pyralux® bonding films include Coverlays which consist of DuPont™ Kapton® polyimide film coated on one side with adhesive, and Bondplys which are coated on both sides. Our Pyralux® Adhesive films are coated onto release paper used primarily to bond flexible inner layers or rigid cap layers in multilayer circuits.

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The Pyralux® family of products include flexible, solderable, metal clad laminates, coverlays, and bonding adhesives for the fabrication of thin, solderable, high density electrical interconnects. These are used to make circuitry for single and double-sided, multilayer flex and rigid-flex applications.

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Pyralux® laminates come in a broad range of copper, dielectric and adhesive thicknesses and are available as adhesive based or adhesiveless constructions.

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Universal test kit is designed for periodic air pressure testing on all Level A fully encapsulated suits.

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