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| Plating |
PlateMaster PM200 |
38 (PM240)
50 (PM250)
75 (PM275)
100(PM299) |
Robust adhesion and high productivity. For volume production of outerlayers in Cu, Sn, Sn/Pb plating. |
| Gold Plating |
GoldMaster GM100 |
75 (GM130)
100 GM140) |
Thick plating resist for selective Cu, Sn/Pb and Ni/Au plating. |
| General Purpose |
MultiMaster MM100i |
38 (MM115i)
50 (MM120i) |
General purpose resist with high productivity, easy stripping. Alkaline etch and strong gold plating performance. |
| MultiMaster MM500 |
30(MM530)
40(MM540)
50(MM550)
65(MM565) |
General purpose resist. Strong performance in high pH alkaline etch and aggressive gold plating. |
| Riston® 200 |
38 (215)
50 (220) |
Wide latitude alkaline etch and gold plating performance. |
| Acid Etch, Chemical Milling |
EtchMaster EM830 |
30(EM830) |
High productivity, fine-line innerlayer perfoamce. Wet lam compatible. |
| Etchmaster EM213 |
32 (EM213) |
High productivity innerlayer film. Strong chem milling performance. |
| Special FX500 |
15 (FX515)
30 (FX530) |
Thin resist for chemical milling and acid etch. |
| Acid Etch, Tent & Etch |
TentMaster TM200i |
32 (TM213i)
38 (TM215i) |
Good conformation and reliable performance acid etch innerlayers. Reliable tenting for tent & etch processes. |
| Fine Line Etching (innerlayer and tent & etch) and plating |
Special FX900 |
30 (FX930)
38 (FX940)
50 (FX950)
62 (FX962) |
High tech/Fine line resist for below 75 µm lines/spaces. Excellent flow during lamination and insensitive to off-contact printing. |
| Selective ENIG |
Special FX250 |
50 (FX250) |
Specialty product for selective e-less Ni/Au plating. |
| Semi-additive Circuit Formation |
Riston® JSF |
25(JSF25) |
Specialty product for semi-additive packaging applications. Superior adhesion to smooth copper. |
| Laser Direct Imaging |
Laser Direct Imaging LDI500 |
30 (LDI530)
38 (LDI540)
50 (LDI550) |
Specialty product for Laser Direct Imaging. Ultra high photospeed. |
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