Flexible/Rigid-Flex Circuits

Polyimide Laminates

Includes the broadest portfolio of copper clad materials of anyone in the industry. Pyralux® laminates come in a broad range of copper, dielectric and adhesive thicknesses and are available as adhesive based or adhesiveless constructions. Adhesive based laminates are made with DuPont™ Kapton® and may be requested with either LF adhesive, for high reliability applications, or FR adhesive, for commercial applications requiring ULV0 recognition. Adhesiveless clads are available in three forms: laminated, cast and sputtered/plated. In addition to providing a thinner form factor, adhesiveless clads are excellent for applications requiring high circuit density, extreme temperatures, chemical resistance, electrical performance and dimensional stability.

Coverlay, Bondply and Sheet Adhesives

DuPont™ Pyralux® adhesives and films are long recognized in the electronics industry. The LF acrylic adhesive system has a proven record of consistency and dependability and is still the industry standard for high reliability printed circuits. FR acrylic adhesives are low cost UL V0 recognized and ideal for commercial applications. Coverlays and bondplys are made with DuPont™ Kapton® film and are available in a wide array of adhesive and film thicknesses using either adhesive system. DuPont also offers a flexible photoimagable dry film used to encapsulate circuitry for applications requiring fine feature resolution.

Polyimide Films

An all-polyimide film that has more than 40 years of proven performance as the flexible material of choice in circuit applications requiring extreme temperatures, chemical and radiation resistance, electrical performance and mechanical stability. The toughness of Kapton® ensures reliability through the most hostile manufacturing and end use environments. Kapton® films are available in a broad range of thicknesses and are easily laminated, metallized, adhesive coated, punched, drilled and formed.

Shielding Materials

Provides low cost alternatives for shielding against electro-magnetic interference (EMI) in circuit applications. PTF pastes enable the fabricator to eliminate one or more copper foil/laminate layers, which saves material and processing costs while creating a thinner form factor. The new generation of copper based pastes are fully screenable and solderable and can be used on a wide variety of substrates to create fully additive circuits and crossovers. The new carbon-based product is a low-cost alternative to gold-plating keypads and connector points.

Dry Film Photoresists & Phototools

DuPont™ Riston® FX Series™ dry film photoresists enable high resolution, exact line edge definition, excellent conformation, and productivity in flex circuit fabrication. DuPont™ YieldMaster® wet lamination further compliments the Riston® offering, providing higher yields through enhanced conformation and adhesion on uneven substrates in complex fine pitch and multilayer circuits.

Complementing  the Riston® product line, the DuPont™ ImageMaster™ Phototools System is a new generation of phototooling products offering unsurpassed line edge quality, precise control, reliable performance and simple processing.