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Semiconductor Packaging & Circuit Materials

Micro Electro Mechanical Systems (MEMS)

DuPont R&D and engineering resources continue to provide innovative ceramic and organic technologies to meet the growing demands of Micro Electro Mechanical Systems (MEMS) and Micro Systems Technology (MST) including: precise fine structures, hermetic, chemical resistance, and thermal management applications.

 

Ceramic Technologies


DuPont™ Green Tape™ System

Look to DuPont LTCC for next generation packaging that requires an improved level of mechanical, thermal, and evironmental stability combined with increased capability to integrate electrical and optical functions. Additonally, all of this has to be delivered to market faster through shorter design cycles and at a lower total system cost. Low Tempature co-fired ceramic materials are proven effective in harsh environment military and deliver proven performance in high volume automotive and wireless applications.



DuPont™ Fodel™ materials

DuPont photo patterning with thick film or LTCC process allows for the formation of fine line features with excellent edge definition. More and more applications are demanding more functionality in smaller packages and the DuPont™ Fodel™ system of photoprintable products significantly increase the density in the X Y plane with no yield penalty. Using Fodel™ materials and processes, the system delivers fine lines in condense conductor traces with 50 micron lines on a 100 micron pitch and spaces on either conventional alumina substrate or LTCC multilayer. Thick Film conductors and DuPont QG160 can be patterned to 25 micron lines and spaces using etching.

 

Organic Technologies


MX Series Microlithographic Polymer Films

Permanent or non permanent materials are available in a wide range of precisely controlled thicknesses (15-100µm). MX Series™ products deliver capability to bridge trenches for structuring of MEMS devices, using a variety of plating chemistries, wet or dry etching.



Liquid Polyimides

Liquid polyimides are being utilized in various MEMs applications.  Polyimides have been successfully used as sacrificial layers, flexible membranes and dielectric layers in MEMS devices. Whether you require a polyimide that has a low CTE of 3ppm/C (PI–2600), a thick film compliant polyimide (HD-7000), or a low  < 250C cure polyimide (HD–8800), we offer the broadest portfolio of liquid polyimides to meet your unique MEMS needs.