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Integrated Wafer Level Packaging Solutions

DuPont is connecting science and technology from across the company to design integrated wafer level packaging solutions for both current and emerging wafer level packaging requirements. A great example is the new set of codesigned products:

  • DuPont™ WBR2000 dry film photoresist and;
  • A new DuPont™ EKC dry film remover

These products provide a step change in precise wafer bumping formation and clean resist removal to meet the most challenging wafer bumping and flip chip bumping requirements.

These integrated wafer level packaging solutions, together with the HD MicroSystems line of redistribution dielectrics, provide a tested and proven solution for area array package requirements, whether stencil printed, plated, pillared or C4 applied. Key benefits of these integrated solutions include higher yields, increased reliability and lower cost of ownership.

Look below for more specifics on integrated wafer level packaging solutions to your current and future challenges.

 
RDL, Bumping and Pillars
HD MicroSystems™ High Purity Polyimide and PBO Coatings Provides the stress relief and redistribution capability to ensure the level of reliability demanded, particularly when used with the other DuPont products below.< »Download Product Information
DuPont™ MX Series Thin dry film photoresists, down to 10 microns, for electroplating, wet and dry etching of redistribution conductors and UBM’s »More
DuPont™ WB Series Thick dry film photoresists provide consistent, precise patterning for stencil printing, plating and C4 deposition using a wide range of metals to form bumps and pillars up to a height of 120 microns with easy application and removal and minimal waste. »More
DuPont EKC Technology Dry Film Remover Has been formulated to enhance the removal of WB and MX Series resists cleanly and efficiently, with full dissolution, preventing redeposition, while minimizing damage to metal conductors, bumps and RDL dielectrics. »More

TSV, Bonding and 3D

Newly developed products from DuPont are enabling next generation packaging technologies.

 
DuPont™ MX Series MX Series dry film photoresists are used in electroplating, wet and dry etching processes to form and/or aid in metalizing "Thru Silicon Vias" (TSV’s). These films are Bosch Process compatible and have unique tenting capabilities to protect vias from subsequent operations.   »More
DuPont EKC Technology Remover and Cleaning Solutions These products can be used for the most demanding resist or etch residue removal and for cleaning.   »More
DuPont™ PerMX Series Epoxy-based dry film permanent photoresists are capable of bonding and cavity formation to precise dimensions and controlled heights up to 20 microns.   »More
HD MicroSystems™ Polyimide and PBO based specialty products This line of products are finding uses in permanent and temporary bonding applications.   »Download Product Information