DuPont Semiconductor Fabrication Materials : News & Events

DuPont Home

Global [change]

MSDS

DuPont Direct

About DuPont

Our Company

Science

Sustainability

Investor Center

Media Center

Career Center

«

«

Semiconductor Fabrication Materials

«

News & Events

Semiconductor Fabrication Materials Home

Products & Services

Uses & Applications

Knowledge Center

Science of Semiconductor Fabrication Materials

News & Events News Archive - 2005

Printer Friendly Version

DuPont Products & Services

DuPont Brands & Trademarks

Semiconductor Fabrication Materials News & Events September 9, 2008 DA NanoMaterials Unveils Innovative Copper Slurry for Next Generation Technologies DA NanoMaterials' CoppeReady® Cu3988 copper series slurry was developed to improve copper dishing, erosion and over-polish window, targeting 45nm and 32nm technology nodes. » More August 8, 2008 DuPont to Showcase Semiconductor Fabrication and Packaging Materials at Semicon Taiwan 2008 DuPont will feature its expanding portfolio of advanced material technologies for semiconductor fabrication, packaging and support systems at Semicon Taiwan 2008. » More July 17, 2008 New Singapore Plant Expands Global Manufacturing of DuPont™ Vespel® Parts for Semiconductor Production DuPont Engineering Polymers today announced that production of its high-growth DuPont™ Vespel® parts and shapes has begun at its newest facility in Singapore. » More July 10, 2008 Spansion Adopts DuPont Performance Elastomers Kalrez® 9100 seals for Increased Productivity DuPont Performance Elastomers (DPE) has successfully collaborated with Spansion Inc. to evaluate a perfluoroelastomer O-ring product designed to help increase the uptime of semiconductor manufacturing equipment. » More July 10, 2008 DuPont Performance Elastomers to Introduce Kalrez® 8900 parts at SEMICON West to help Increase Uptime and Improve Wafer Yields in Semiconductor Thermal Processes Kalrez® 8900 parts demonstrate longer seal life in higher temperature semiconductor manufacturing processes and help cut costly downtime and reduce cost of ownership. » More June 23, 2008 DuPont to Feature Semiconductor Materials at SEMICON West 2008 DuPont will exhibit its portfolio of advanced material technologies for semiconductor fabrication and packaging at SEMICON West in San Francisco, July 15-17, 2008. » More June 11, 2008DuPont Electronic Technologies Announces Global Price Increase DuPont Electronic Technologies cites rising raw material, transportation and energy costs among its reasons for the increase. »More May 5, 2008 DuPont will participate in the Symposium on Polymers for Microelectronics The Symposium On Polymers for Microelectronics is one of the foremost comprehensive technical meetings for the integration and processing of polyimides and new polymeric films for advanced microelectronic applications. » More February 22, 2008 DuPont to Showcase Semiconductor Materials at Semicon China 2008 DuPont will feature its portfolio of innovative materials and process expertise for the semiconductor industry at Semicon China 2008. » More September 17, 2007 DuPont to Showcase Semiconductor Materials at SEMICON Europa 2007 DuPont will feature its expanding portfolio of advanced packaging materials at SEMICON Europa 2007. » More September 7, 2007 DuPont Air Products NanoMaterials L.L.C. Launches New Tunable Barrier Slurry for Advanced Technology Nodes DuPont Air Products NanoMaterials L.L.C. (DA NanoMaterials), a 50/50 joint venture of DuPont and Air Products, today launched a non selective chemical mechanical planarization (CMP) barrier slurry with tunable copper, barrier and dielectric polishing rates for use with advanced technology nodes. » More August 29, 2007 DuPont to Feature Semiconductor Materials at Semicon Taiwan 2007 DuPont will showcase its expanding portfolio of semiconductor fabrication and advanced packaging materials at Semicon Taiwan 2007. » More July 11, 2007 DuPont Electronic Technologies Formalizes Interconnect Collaboration with IMEC DuPont Electronic Technologies today announced that the company has joined IMEC as an Industrial Affiliate in 45nm and 32 nm technology development programs on cleaning, contamination control and advanced interconnects. » More July 17, 2007 Semicon West 2007 Technology Innovation Showcase features DuPont EKC Technology "DuPontTM CuSolveTM EKC520TM – An Environmentally Sustainable Solution for Cu / Low-k Cleaning of Advanced Technology Devices" will be presented as part of the Semicon West 2007 Challenges in Device Scaling TechXPOT. » More June 26, 2007 DuPont Semiconductor Fabrication & Packaging Materials Hosts Technical Panel Discussion at SEMICON West 2007 DuPont Semiconductor Fabrication and Packaging Materials has announced it will host a technical panel discussion, "Technology Partnerships & Tools for the Future", featuring experts from leading companies including Intel, Spansion, Applied Materials, ASML, Brewer Science, SEMATECH and the University of Arizona's Center for Environmentally Benign Semiconductor Manufacturing. » More March 01, 2007 DuPont Performance Elastomers Kalrez® 9100 Parts Surpass Planned Maintenance Standards, Increase Uptime, Improve Wafer Yield DuPont Performance Elastomers Kalrez® 9100 perfluoroelastomer parts are specifically designed for ultra-low contamination in aggressive plasma environments. » More October 30, 2006 DuPont Breaks Ground for New Vespel® Plant in Singapore The new facility is the investment in a high-growth business - DuPont™ Vespel® parts and shapes. Industry demand for metals-replacement technologies that reduce weight and cost is driving a step-change for our business. » More August 31, 2006 DuPont Sponsored Panel Discussion at SEMICON West Now Featured Online DuPont today announced it has made available on its web site video of presentations made at a technical seminar it sponsored during SEMICON West 2006 in San Francisco, Calif. New materials on the roadmap was the topic of the seminar. » More July 24, 2006 DuPont Opens Semiconductor Materials Technical Center in Taiwan As part of its strategic plan for long term growth in the semiconductor materials market, DuPont Electronic Technologies has established a Semiconductor Materials Technical Center in Taiwan's Hsinchu Science Park. » More July 11, 2006 DuPont EKC Technology Introduces New Family of Products for Copper Interconnect Cleaning at SEMICON West 2006 DuPont EKC Technology, part of DuPont Electronic Technologies, today announced the introduction of a new series of products for the BEOL (Back End of Line) cleaning of copper interconnects in semiconductors. » More July 11, 2006 DuPont Performance Elastomers Spearheads SEMICON Successes with Kalrez® Seals At Semicon West 2006, DuPont Performance Elastomers will focus on its range of Kalrez® perfluoroelastomer parts for reduced particle adders and improved equipment reliability in Etch and CVD processes. » More June 15, 2006 DuPont Showcases Semiconductor Fabrication & Packaging Materials at SEMICON West 2006 DuPont today announced it will showcase its expanding portfolio of semiconductor fabrication and advanced packaging materials at SEMICON West 2006 at the Moscone Center in San Francisco, Calif., July 11 - 13. By connecting science and technology from across the company, DuPont has established a leading position in the industry with highly engineered materials and advanced process expertise. » More		Events SEMICON Taiwan 2008 September 9 - 11, 2008 Taipei, Taiwan
FAQ \| Supplier Center \| Site Map \| Legal Notices & Terms of Use \| PRIVACY Do you have an upgrade or comment about this page? Please contact Corporate Information Center. Copyright © 2008 DuPont. All rights reserved. The DuPont Oval Logo, DuPont™, The miracles of science™ and all products denoted with ® or ™ are registered trademarks or trademarks of E. I. du Pont de Nemours and Company or its affiliates.